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This wiring layer structure includes: an underlying substrate of a semiconductor substrate or a glass substrate; an oxygen-containing Cu layer or an...

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seizure showing posteriorly-oriented rolandic spikes Kakisaka, Yosuke Nakasato, Nobukazu Haginoya...” Artikel. Zu den Favoriten. Volltext.

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CA A1 - Copper alloy and copper alloy sheet Google...

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Other languages: English: French; Inventor: Keiichiro Oishi: Yosuke Nakasato: Takashi Hokazono; Current Assignee. The listed assignees may be inaccurate.

EP A4 - Copper alloy Google Patents

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Other languages: German: English: French; Inventor: Keiichiro Oishi: Yosuke Nakasato: Katsuhiko Hata: Shinji Tanaka; Current Assignee.

CA A1 - Copper alloy Google Patents

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... PCT/JP , PCT/JP , PCT/JP , PCT/JP , PCT/JP , PCT/JP , PCT/JP , PCT/JP , PCT/JP , PCT/JP , PCT/JP , PCT/JP Inventors, Keiichiro Oishi, Yosuke Nakasato, Katsuhiko Hata, ...

Yosuke Nakasato, Osaka JP - Patent applications

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TARGET FOR FORMING THIN FILM TRANSISTOR WIRING FILM - This ...

COPPER-ALLOY PLATE FOR TERMINAL/CONNECTOR MATERIAL ...www.patentsencyclopedia.com › app

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Inventors: Keiichiro Oishi (Osaka, JP) Takashi Hokazono (Osaka, JP) Michio Takasaki (Osaka, JP) Yosuke Nakasato (Osaka, JP) Yosuke Nakasato (Osaka, JP)

CA A1 - Feuille d'alliage de cuivre et procede de production de...

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Nhà sáng chế, Keiichiro Oishi, Takashi Hokazono, Michio Takasaki, Yosuke Nakasato. Người nộp đơn, Mitsubishi Shindoh Co., Ltd., Mitsubishi Materials ...

US A1 - Sputtering target for forming wiring film of flat...

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A copper alloy wiring film of a flat panel display of the present invention and a sputtering target for forming the same have a composition including Mg:...

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Nakasato, JP - Patent applications

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Yosuke Nakasato, Osaka JP. Patent application number, Description ≦[Zn]+9×([Sn]−0.25), Patent applications by Yosuke Nakasato, Osaka JP ...

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CA A1 - Copper alloy and copper alloy sheet Google...

EP A4 - Copper alloy Google Patents

CA A1 - Copper alloy Google Patents

Yosuke Nakasato, Osaka JP - Patent applications

COPPER-ALLOY PLATE FOR TERMINAL/CONNECTOR MATERIAL ...www.patentsencyclopedia.com › app

CA A1 - Feuille d'alliage de cuivre et procede de production de...

US A1 - Sputtering target for forming wiring film of flat...

gaceta de la propiedad industrial

Nakasato, JP - Patent applications