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Yinon Degani, 58, Highland Park, Cleveland Ave
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Yinon S Degani 10 Cleveland Ave Highland Park, NJ Age 58 (Born Aug 1957) (732)
Business Profiles
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AGERE SYSTEMS INC.
Books & Literature
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Official Gazette of the United States Patent and Trademark ...books.google.ch › books
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6,100,475 SOLDER BONDING PRINTED CIRCUIT BOARDS Yinon Degani, Highland Park, and King Lien Tai, Berkeley Heights, both of N.J., assignors to ...
Bioelectrochemistry: Fundamentals, Applications and Recent...
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Bioelectrochemistry is a fast growing field at the interface between electrochemistry and other sciences such as biochemistry, analytical chemistry and...
Nanomaterials for Biosensors: Fundamentals and Applications - Bansi...
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Nanomaterials for Biosensors: Fundamentals and Applications provides a detailed summary of the main nanomaterials used in biosensing and their application. It...
Related Documents
Surface mount solder assembly of leadless integrated circuit packages...
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Described are a process for soldering at least one component having solder bumps to a substrate and a process for forming solder bumps on metal pads of an...
Manufacturing at the Wafer Level - iBrarianwww.ibrarian.net/navon/paper/_Manufacturing_at_the_Wafer_Level_.pdf?paperid...
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Intel Corporation. "Implementation of Chip Scale Modules in Wireless Mobile. Devices". Dr. Yinon Degani, Director of Research & Development. Dr. Moses Asom ...
Scientific Publications
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Itamar Willner, Zafrir Goren, Daniel Mandler, Ruben Maidan, Yinon Degani. Department of Organic Chemistry, The Hebrew University of Jerusalem, Jerusalem Israel.
Publications
Direct Electrical Communication between Chemically Modified Enzymes...
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Electrical communications between enzymes and metal electrodes is an element in the bridging of electronics and biochemistry and is of specific relevance to...
Miscellaneous
Yinon Degani | LinkedIn
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CN A - 用于同时接收重叠频带中信号的双波段接收机 - Google ...
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US A1 * Yinon Degani Cellular/Wi-Fi combination devices. US B Iwao Fujisaki ...
CA A1 - Solder Paste Google Patents
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Other languages: English: French; Inventor: Yinon Degani; Current Assignee ... CA A1 * Yinon Degani Integrated circuit ...
EP A2 - Translator for recessed flip-chip package
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Other languages: German: English: French; Inventor: Yinon Degani: Thomas Dixon Dudderar: Robert Charles Frye: King Lien Tai; Current Assignee. The listed ...
Effects of hydrophobic association and interfacial surface potential...
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Photoinduced reductions of anthraquinone sulophonates in positively charged micelles and vesicles are affected by the interfacial surface potential and the...
Photosensitized cleavage of acetylene to methane - Journal of the...
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Yinon Degani and Itamar Willner Abstract. Photosensitized reductive cleavage of acetylene to methane is accomplished in an aqueous solution that ...
AT&T Technical Journal
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Jeffrey A. Gregus and Maureen Y. Lau and Yinon Degani and King L. Tai Chip-scale modules for high-level integration in the 21 st century
US A - Electronic device package having electronic device...
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Yinon Degani, Thomas D. Dudderar, Byung J. Han, Venkataram R. Raju: Original Assignee: At&T Corp. Export Citation: BiBTeX, EndNote, RefMan: Patent Citations (4 ...
EP A3 - Electronchemical processes involving ...www.google.com.af › patents
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Other languages: German: French; Inventor: Yinon Degani: Adam Heller; Current Assignee. The listed assignees may be inaccurate. Google has not performed ...
EP A2 - RF IC package Google Patents
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Other languages: German: French; Inventor: Yinon Degani: Peter R. Smith: King Lien Tai; Current Assignee. The listed assignees may be inaccurate.
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DESIGN AND RELIABILITY OF SOLDERS AND SOLDER INTERCONNECTS: V:...
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DESIGN AND RELIABILITY OF SOLDERS AND SOLDER INTERCONNECTS: Session V: Interconnect Design and Reliability in Electronic Packages I ... Yinon Degani, …
Degani, US - Patent applications
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Degani, US Amir Degani, Pittsburgh, PA US. Patent application number Description Published; : ... Patent applications by Yinon Degani, Highland Park, NJ US.
EP A2 - Compact balun transformers - Google Patentsgoogle.com › patents
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Other languages: German: English: French; Inventor: Jian Cheng: Yinon Degani: Yu Fan: Charley Chunlei Gao: Kunquan Sun: Liguo Sun; Current Assignee.
US A1 - SDIO memory and interface card - Googlewww.google.co.in › patents
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Inventor: Moses Asom: Yinon Degani: Joe Ryan: Kunquan Sun: Yanbing Yu: Meng Zhao; Current Assignee. The listed assignees may be inaccurate.
RF devices - Patent application
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Patent application title: RF devices Inventors: Yinon Degani (Highland Park, NJ, US) IPC8 Class: AG08B1314FI USPC Class: Class name: Article placement or ...
Invitation for a Seminar: High Density Board Assemblies
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High Density Board Assemblies: Design, Components and Assembly 27 November 2006, ... Dr. Yinon Degani is a senior director in SyChip Inc. (a Subsidiary of MuRata)
Electrochemistry in Diabetes Management - Accounts of Chemical - PDF...
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Apr 12, Electrochemistry in Diabetes Management. Adam Heller*. Department of Chemical Engineering, University of ...
US B2 - Semiconductor device and method of forming integrated...
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A method of manufacturing a semiconductor device includes providing a substrate with an insulation layer disposed on a top surface of the substrate,...
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