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Japanese Inventors Develop Mold Resin-Sealed Power Semiconductor...

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ALEXANDRIA, Va., Dec Dai Nakajima, Kazuhiro Tada and Yasunari Hino, all from Tokyo, and... | Article from US Fed News Service, Including US State News...

Japanese Inventors Develop Semiconductor Switching Elements...

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ALEXANDRIA, Va., Sept Yasunari Hino, Hiroyuki Akita, Masaki Kato and Yoshihito Asao, all... | Article from US Fed News Service, Including US State News...

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Mitsubishi Electric Corporation patent inventors (2015)

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A list of inventors with patent application filings associated with Mitsubishi Electric Corporation for Yasunari Hino. Yasunari Matsumoto. Yasunari Matsumoto.

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MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP

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JPS A - Underground continuous wall construction work...

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Yasunari Hino Original Assignee Ohbayashigumi Ltd Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.) Filing date Publication date

US A - IC controlled DC motor Google Patents

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A DC motor having a housing, a hub member rotatably supported by the housing, a flexible printed circuit board fixedly mounted on the housing, and an IC...

AUTOMOTIVE ELECTRIC MOTOR-GENERATOR WITH RADIAL PLATES AND CIRCUIT...

www.patentsencyclopedia.com

Inventors: Yasunari Hino (Tokyo, JP) Yoshihito Asao (Tokyo, JP) Assignees: Mitsubishi Electric Corporation IPC8 Class: AH02K906FI USPC Class:

BONDING STRUCTURE INCLUDING METAL NANO PARTICLES AND BONDING METHOD...

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Patent application title: BONDING STRUCTURE INCLUDING METAL NANO PARTICLES AND BONDING METHOD USING METAL NANO PARTICLES Inventors: Aya Iwata (Tokyo, JP) Yasunari Hino (Tokyo, JP) Assignees: Mitsubishi Electric Corporation IPC8 Class: AH01L2300FI USPC Class: Class name: Active solid-state devices (e.g., transistors, solid-state diodes) specified wide band …

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - Patent...

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Inventors: Yasunari Hino (Tokyo, JP) Assignees: Mitsubishi Electric Corporation IPC8 Class: AH01L2300FI USPC Class: Class name: Active solid-state devices (e.g., transistors, solid-state diodes) combined with electrical contact or lead die bond Publication date: Patent application number:

US B2 - Method for assembling semiconductor switching elements...

patents.google.com

A method for assembling semiconductor switching elements and a heat sink in a rotary electric machine includes: a first step in which bare chips of the...

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