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U.S. Patents Awarded to Inventors in Arizona (Feb. 7)
targetednews.com
[Targeted News Service (subscription)] Stats Chippac, Fremont, Calif., has been assigned a patent ( ) developed by Kambhampati Ramakrishna, Chandler, Ariz., Il Kwon Shim, Singapore, and Seng Guan Chow, Singapore, for a "semiconductor packaging system with stacking and method of
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