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WEI-PING DOW. Professor at National Chung Hsing University. 所屬產業 化工研發
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Wei-ping Dow - Patents
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Wei-ping Dow patents Recent bibliographic sampling of Wei-ping Dow patents listed/published in the public domain by the USPTO (USPTO Patent Application #,Title):
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ROCKWOOD ELECTROCHEMICALS ASIA LTD.
Books & Literature
Wei-Ping Dow | XanEdu Customization Platform
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Author: Wei-Ping Dow. Results. Studies of microvia filling mechanism and a novel Cu plating formula IEEE By: Lefebvre, M.J. ...
Related Documents
Periodic Pulse Reverse Cu Plating for Through-Hole Filling
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Wei-Ping Dow, Jing-Yuan Lin, Wu-Chung Chang, and Horn-Chin Lee; Periodic Pulse Reverse Cu Electroplating for Through Hole Filling Meet. MA (34): …
name list - ACEC2008
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Chen Wei Hsiang. National Chung Hsing University. Taiwan DOW. WEI- PING. WEI-PING DOW. 竇維平. WEI-PING DOW. National Chung Hsing University.
Scientific Publications
Electrochimica Acta | Vol 109, Pages (30 October 2013) |...
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The online version of Electrochimica Acta at ScienceDirect.com, the world's leading platform for high quality peer-reviewed full-text journals.
A novel copper electroplating formula for laser-drilled micro via...:...
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filling. Wei-Ping Dow. Department of Chemical Engineering, National Yunlin ...
Journal of Catalysis | Vol 160, Issue 2, Pages (May 1996) |...
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The online version of Journal of Catalysis at ScienceDirect.com, the world's leading platform for high quality peer-reviewed full-text journals.
Micro via filling plating technology for IC substrate application...:...
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Cheng-Ching Yeh. Rockwood Electrochemicals Asia Ltd, Taiwan, R.O.C. Kuo-Hsing Lan. Rockwood Electrochemicals Asia Ltd, Taiwan, R.O.C. Wei-Ping Dow.
Publications
Through Hole Plating | SpringerLink
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Through Hole Plating Book Title Copper Electrodeposition for Nanofabrication of Electronics Devices Book Part Part III ... Wei-Ping Dow (6) Author Affiliations. 6.
Miscellaneous
WEI-PING DOW | LinkedIn
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Primo by Ex Libris - Wei-Ping Dow
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Wei-Ping Dow ; Her-Shu Huang. Journal of The Electrochemical Society 152, C67 (2005) [Revista Peer Reviewed]. ISSN: ; DOI:
A novel copper plating formula for through silicon holes filling in a...
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Wei-Ping Dow. Dept. of Chem. Eng., Nat. Chung Hsing Univ., Taichung, Taiwan autor Jing-Yuan Lin. Microsyst. Technol. Center, Ind. Technol. Inst ., Hsinchu ...
In Situ STM Study of Cu Electrodeposition on TBPS-Modified Au(111)...
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Authors: Yung-Fang Liu, Klaus Krug, Pin-Chun Lin, Yong-Da Chiu, Wei-Ping Dow et al. Journal: Electrochemical/Chemical Deposition and Etching
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Wei-Ping Dow a and Ming-Yao Yen a; a National Yunlin University of Science & Technology Abstract. Abstract not Available. © ECS - The Electrochemical ...
Modification of Cu nanoparticles with a disulfide for polyimide...
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Wei-Ping Dow, Guo-Liang Liao, Shang-En Huang and Sinn-Wen Chen J. Mater. Chem., 2010, 20, DOI: B D ...
Program List : IUMRS-ICA 2014
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International Union of Materials Research Societies- The IUMRS International Conference in Asia 2014
Revelation of the spatial structures and polymerization of aniline on...
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Shuehlin Yau, YiHui Lee, ChinZen Chang and Wei-Ping Dow Chem. Commun., 2009, DOI: B J ...
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Wei-Ping Dow, Chun-Wei Lu, Jing-Yuan Lin, and Fu-Chiang Hsu; Highly Selective Cu Electrodeposition for Filling Through Silicon Holes Electrochem.
Table of Contents — 2013, 2 (5)
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Wei-Ping Dow, An-Hong Liu, Jing-Yuan Lin, Ping-He Chang, and Su-Mei Huang; Periodic Pulse Reverse Cu Plating for Through-Hole Filling ECS Electrochem.
The Electroanalysis of Janus Green B and the By-Products thereof in...
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Xuan-Wen Lu a and Wei-Ping Dow b; a Chemical Engineering, National Chung Hsing University, 250, Kuo-Kuang Road, Taichung, Taiwan
Symposium: (2014 ECS and SMEQ Joint International Meeting (October...
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Co-organizers: Rohan Akolkar (Case Western Reserve University) , D. P. Barkey (University of New Hampshire) , Wei-Ping Dow (National Chung Hsing ...
224th ECS Meeting (October 27 November 1, 2013): Three Dimensional...
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Shih-Cheng Chang, master, National Chung Hsing University Department of Chemical Engineering; Wei-Ping Dow, National Chung Hsing University. See more ...
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