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Wei-Chi Yih - Patents

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Wei-Chi Yih patents. Recent bibliographic sampling of Wei-Chi Yih patents listed/ published in the public domain by the USPTO (USPTO Patent Application # ...

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patentbuddy: Wei-Chi Yih

ADVANCED SEMICONDUCTOR ENGINEERING, INC., Taichung City, TW, US

patentbuddy: Wei Chi Yih

ADVANCED SEMICONDUCTOR ENGINEERING, INC., Taichung, TW, US

Property

SEMICONDUCTOR PACKAGE, METHOD FOR ENHANCING THE BOND OF A BONDING...

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Patent applications by Wei-Chi Yih, Taichung City TW. Patent applications by Yi Shao Lai, Yonghe City TW. Patent applications by ADVANCED SEMICONDUCTOR ENGINEERING, INC.

Yih - Patent applications

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Wei-Chi Yih, Taichung City TW. Patent application number Description Published; : WAFER AND SEMICONDUCTOR PACKAGE - A wafer defines a plurality of chips

Miscellaneous

Patent US Wafer-level semiconductor device packages with...

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Inventors, Chi-Tsung Chiu, Kuo-Hsien Liao, Wei-Chi Yih, Yu-Chi Chen, Chen- Chuan Fan. Original Assignee, Advanced Semiconductor Engineering, Inc.

Patent US Semiconductor package, method for enhancing the...

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A wire bonding structure of a semiconductor package includes a bonding wire, a pad and a non-conductive adhesive material. The bonding wire includes a line...

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