Loading...
Images of Wael Zohni
(0 from 0 )1
0
0
News
2nd Symposium Program
www.ieee-csj.org
... K Appelt, Andy Tseng, Shoji Uegaki, Louie Huang (ASE Group), Vern Solberg, Wael Zohni and Ilyas Mohammed (Invensas Corporation).
Telephone & Addresses
Wael Zohni, 44, Ashville, PO Box *****
View Wael's social profiles and photos on Facebook, MySpace, and +40 Networks.
Wael Zohni, Worcester, Institute Rd
View Wael's social profiles and photos on Facebook, MySpace, and +40 Networks.
Wael O Zohni, …ord, Zain Cir
View Wael's social profiles and photos on Facebook, MySpace, and +40 Networks.
Wael O Zohni, 44, San Jose, PO Box *****
View Wael's social profiles and photos on Facebook, MySpace, and +40 Networks.
Network Profiles
Interests
Tessera Inc patent inventors (2012)
stks.freshpatents.com
Wael Zohni · Wei-shun Wang · Yan Zhang · Yoshikuni Nakadaira · Zach Traina. Browse by year: Tessera Inc patents ...
U.S. Patents Awarded to Inventors in California (May 19)
www.tmcnet.com
The co-inventors are Richard Dewitt Crisp, Hornitos, California, Wael Zohni, San Jose, California, Belgacem Haba, Saratoga, California, and ...
Wael Zohni - Patents
www.freshpatents.com
The bibliographic references displayed about Wael Zohni's patent applications are for a recent sample of publicly published patent applications. ...
Business Profiles
patentbuddy: Wael Zohni
TESSERA, INC., San Jose, CA, US
patentbuddy: Wael O Zohni
GOOGLE INC., San Jose, CA, US
Education
classmates: Wael Zohni
Worcester Polytechnic Institute, Worcester, MA,
Property
WO A2 - Microelectronic packages and methods therefor...
patents.google.com
Requerente, Tessera Inc, Belgacem Haba, Masud Beroz, Ronald Green, Ilyas Mohamed, Stuart E Wilson, Wael Zohni, Yoichi Kubota, Jesse Burl Thompson.
Related Documents
Cost-minimized double die DRAM packaging for ultra-high performance...
researchr.org
... server DIMMs}, author = {Richard Crisp and Bill Gervasi and Wael Zohni and Bel Haba}, year = {2012}, doi = {http://dx.doi.org ISQED }, ...
Publications
Component packaging. - Free Online Library
www.thefreelibrary.com
Authors: Vern Solberg, Charles Woychik, Wael Zohni and Ilyas Mohammed; vernsolberg@attnet. Abstract: This paper introduces an ultra high-I0 ...
In case you missed it. - Free Online Library
www.thefreelibrary.com
Die Stacking "Near Term Solutions for 3D Packaging of High Performance DRAM " Authors: Vern Solberg and Wael Zohni Abstract: Stacking two or more ...
Video & Audio
RealVoters Pinpoint Voters and Votes in San Jose CA
voterfactory.com
RealVoters Voter Predictions with Pinpoint Accuracy for California
Reports & Statements
DDP vs. monolithic memory packages and their impact | ddr3memory
ddr3memory.wordpress.com
32GB RDIMMs/LRDIMMs vs. 32GB HyperCloud Both 32GB RDIMMs and 32GB LRDIMMs being offered today are using 4Gbit x 2 DDP memory packages. 32GB HyperCloud are...
Second take | ddr3memory
ddr3memory.wordpress.com
UPDATE: added : Invensas on LRDIMM design inferiority vs. HyperCloud Basically LRDIMMs and DDR4 are both going to be using NLST IP. This article...
Miscellaneous
US A1 - Through interposer wire bond using low cte...
patents.google.com
... US A1, US A1, US A1. Inventeurs, Simon McElrea, Wael Zohni, Belgacem Haba. Cessionnaire d'origine, Tessera, Inc.
WO A9 - De-skewed multi-die packages Google...
patents.google.com
Inventors, Richard Dewitt Crisp, Belgacem Haba, Wael Zohni. Applicant, Tessera, Inc. Export Citation, BiBTeX, EndNote, RefMan. Classifications (68), Legal ...
Wael Zohni, San Jose US - Patent applications
www.patentsencyclopedia.com
Patent application number, Description, Published , Semiconductor chip packages having cavities - Packaged microelectronic elements are ...
Arisa Enterprises, Llc - Nevada Company Profile (NvAnnualReport.com...
www.nvannualreport.com
1756 Cheney Drive San Jose, CA Wael Zohni Cheney Drive San Jose, CA Order Business Services For Arisa Enterprises, ...
BiTS Workshop
www.testconx.org
Burn-in and Test Socket Workshop, the only technical conference dedicated to the advancement of burn-in and test sockets for the semiconductor industry.
Higher Density PoP Semiconductor Packaging Solution Free pdf download...
www.docdatabase.net
Higher Density PoP Semiconductor Packaging Solution: Bridging the Infrastructure Gap Between Wire-Bo This file you can free download and review.
Invensas Corporation
smtnet.com
Invensas is focused on the development of cutting-edge enabling technologies in advanced semiconductor packaging for advanced mobility and storage products.
MULTIPLE DIE IN A FACE DOWN PACKAGE - Patent application
www.patentsencyclopedia.com
Inventors: Belgacem Haba (Saratoga, CA, US) Wael Zohni (San Jose, CA, US) Wael Zohni (San Jose, CA, US) Richard Dewitt Crisp (Hornitos, ...
ISQED Program Rev. 3
www.isqed.org
... DRAM Packaging for Ultra-High Performance DDR3 and DDR4 Multi-Rank Server DIMMs. Richard Crisp, Bill Gervasi, Wael Zohni, Bel Haba
Wael - Patent applications
www.patentsencyclopedia.com
Wael Zohni, San Jose, CA US. Patent application number Patent applications by Wael Zohni, San Jose, CA US. Website © Advameg, Inc.
Semiconductor chip packages having cavities - Patent application
www.patentsencyclopedia.com
11 Dec Patent applications by Wael Zohni. Patent applications by ...
Related search requests for Wael Zohni
| Bill Gervasi |
People Forename "Wael" (1876) Name "Zohni" (14) |
sorted by relevance / date