Susanto Tanary - Free People Check with News, Pictures & Links

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Susanto Tanary, 44

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Susanto Tanary's Phone & Address | PeopleByName

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Susanto Tanary 513 Van Buren St Iowa City, IA Age 43 (Born Jul 1971). Background Check - Available. Record ID: Susanto Tanary

Network Profiles

LinkedIn: Susanto Tanary - Regional Head, Global Outsourcing ...sg.linkedin.com › susanto-tanary-3a1aa342

Susanto Tanary. Regional Head, Global Outsourcing Business Management at ST Microelectronics. ST MicroelectronicsThe University of Texas at Austin.

Facebook: Profils Susanto Tanary | Facebook

Susanto Tanary sur Facebook. Inscrivez-vous sur Facebook pour communiquer avec Susanto Tanary et d'autres ...

Facebook: Susanto Tanary | Facebook

Susanto Tanary is on Facebook. Join Facebook to connect with Susanto Tanary and others you may know. Facebook gives people the power to share and ...

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patentbuddy: Susanto Tanary

UNITED TEST AND ASSEMBLY CENTER LTD., Singapore, SG, US

Property

US B2 - Thermally enhanced semiconductor package and method of...

patents.google.com

This invention includes a heat sink structure for use in a semiconductor package that includes a ring structure with down sets and a heat sink connected...

Publications

Thermal Performance Enhancement for CSP Packages - CORE

core.ac.uk

By Danny Retuta, Y. Y. Ma, Ravi Kanth, Tan Hien Boon, Anthony Sun and Susanto Tanary. Abstract. Attaching heat spreader into the IC package is a known and common solution for devices with specific thermal requirement. This is usually seen on medium to big size packages such as PBGA where space is not a constraint. However, for chip-scale ...

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Susanto Tanary | LinkedIn

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View Susanto Tanary’s professional profile on LinkedIn. LinkedIn is the world's largest business network, helping professionals like Susanto Tanary discover inside ...

US A1 - Stacked Die Packages Google Patents

patents.google.com

A stacked die semiconductor package that includes a substrate with a plurality of adhesive portions arranged in a manner to create at least one gap...

US B2 - Leadframe enhancement and method of producing a...

patents.google.com

A semiconductor package includes a plurality of first leads, each with a top outer portion removed from the lead and an outer end, and a plurality of...

utacguys groups - Yahoo Groups

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... Susanto Tanary/UTAC@UTAC, Toh Chin Hock/UTAC@UTAC, Zhu Wen Hui/ UTAC@UTAC, Cheang Kum Hon/UTAC@UTAC, Anthony Sun ...

INTERPOSER FOR SEMICONDUCTOR PACKAGE - Patent application

www.patentsencyclopedia.com

Patent application title: INTERPOSER FOR SEMICONDUCTOR PACKAGE Inventors: Chin Hock Toh (Singapore, SG) Chin Hock Toh (Singapore, SG) Yao Huang Huang (Singapore, SG) Ravi Kanth Kolan (Singapore, SG) Wei Liang Yuan (Singapore, SG) Susanto Tanary (Singapore, SG) Yi-Sheng Anthony Sun (Singapore, SG) Yi-Sheng Anthony Sun (Singapore, SG) Assignees: UNITED TEST AND ASSEMBLY …

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