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News
Tiny "Nanofingers" To Support Sensors, Other Applications
news.osu.edu
[Embargoed for release until 2:00 AM ET, Monday, December , 2003, to coincide with presentation at the International Conference
on Materials for...
Telephone & Addresses
Sehoon Yoo, Columbus, US, Hedgerow Rd, Unit J
View Sehoon's social profiles and photos on Facebook, MySpace, and +40 Networks.
Sehoon Yoo, Atlanta, US, Potomac Rd
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Sehoon Yoo, Columbus, US, Curl Dr
View Sehoon's social profiles and photos on Facebook, MySpace, and +40 Networks.
Sehoon Y Yoo, Atlanta, US, Virginia Rd
View Sehoon's social profiles and photos on Facebook, MySpace, and +40 Networks.
Network Profiles
LinkedIn: SeHoon Yoo - LinkedIn
SeHoon Yoo 님의 LinkedIn 프로필 보기 LinkedIn은 SeHoon Yoo 님과 같은 인재들이 다른 인재, 분야 전문가, 비즈니스 파트너 등과 인맥을 맺도록 도와드리는 세계 ...
LinkedIn: Sehoon Yoo - 동명이인 보기 - LinkedIn
Sehoon Yoo 님의 LinkedIn 프로필 보기 LinkedIn은 Sehoon Yoo 님과 같은 인재들이 다른 인재, 분야 전문가, 비즈니스 파트너 등과 인맥을 맺도록 도와드리는 세계 ...
Interests
Tiny 'nanofingers' to support sensors, other applications |...
www.eurekalert.org
Future sensors may take the form of microscopic finger-like structures developed at Ohio State University. Engineers here have found an easy way to carve the...
Business Profiles
Xing: Sehoon Yoo - Digital Circuit Design (FPGA/ASIC), Embedded Systems -...
Ausbildung, Kontaktdaten und weitere Infos: Erfahren Sie mehr – oder kontaktieren Sie Sehoon Yoo direkt bei XING.
patentbuddy: Sehoon Yoo
THE OHIO STATE UNIVERSITY RESEARCH FOUNDATION, Columbus, OH, US
Books & Literature
外文检索
scholar.cnki.net
Author：Sehoon Yoo , Weon-Kyong Kim ... Data Source：[J].International Journal of Automotive Technology(IF 0.69), 2017, Vol.18 (3), pp Springer.
Journal of Welding and Joining (JWJ)e-jwj.org › articles › search_result
www.e-jwj.org
Jong-Hoon Back, Sehoon Yoo, Deok-Gon Han, Seung-Boo Jung, Jeong-Won Yoon. Journal of Welding and Joining: Publication Date (Web): September ...
:: Journal of Welding and Joining (JWJ) ::
www.e-jwj.org
Young-Ki Ko, Myung-Suk Kang, Sehoon Yoo, Chang-Woo Lee. Journal of KWJS June;30(3): Publication Date (Web): July
Nanostructured Materials and Nanotechnology II - Google Books
books.google.de
A collection of papers from The American Ceramic Society s 32nd International Conference on Advanced Ceramics and Composites, held in Daytona Beach, Florida,...
Related Documents
Effects of Surface Finishes and Current Stressing on Interfacial...
www.proquest.com
JAE-MYEONG KIM,1 MYEONG-HYEOK JEONG,1 SEHOON YOO,2 and YOUNG-BAE PARK1,3. 1.—School of Materials Science and ...
Facile Design of Conductive Ag-PDMS Electrodes for Stretchable...
www.proquest.com
SEHOON YOO,3 KWANGBO SHIM,1 and SUNGWOOK MHIN 3,4. 1.—Department of Materials Science and Engineering, Hanyang University, Seoul ,.
Publications
SiC-NANOPARTICLE DISPERSED COMPOSITE SOLDER BUMPS FABRICATED BY...
core.ac.uk
by yue-seon shin, young-ki ko, jun-ki kim, sehoon yoo and chang-woo lee
Effect of Bath Life of Ni(P) on the Brittle-Fracture Behavior of...
link.springer.com
The effect of bath life of Ni(P) on the brittle-fracture behavior of Sn-3.0 wt.%Ag-0.5 wt.%Cu ... Sehoon Yoo Affiliated with Welding and Joining R&BD Group, ...
The effect of intermetallic compound evolution on the fracture...
link.springer.com
The microstructure and joint properties of Au stud bumps joined with Sn-3.5Ag solder were investigated as functions of flip chip bonding temperature and ag
Miscellaneous
Sehoon Yoo | LinkedIn
www.linkedin.com
View Sehoon Yoo’s professional profile on LinkedIn. LinkedIn is the world's largest business network, helping professionals like Sehoon Yoo discover inside ...
Yoonki Sa - Google 학술검색 서지정보 - Google Scholarscholar.google.com › citations
scholar.google.com
Effect of Complex Environment on Various Lead-free Solder Joints. Yong-Ho Ko, Y.K. Sa, Sehoon Yoo, C-W. Lee. MS&T (Materials Science & Technology),
WO A3 - Method of forming nanostructures on ceramics and the...
patents.google.com
... WO-A , WO A3, WO A3, WO A3. Inventors, Sheikh A Akbar, Sehoon Yoo, Kenneth H Sandhage. Applicant ...
Yoonki Sa - Google Scholar Citations
scholar.google.nl
Evaluation of Lead-free Solder Joint under Vibration and High Temperature. Y.H. Ko, Y.K. Sa, Sehoon Yoo, Chang-Woo Lee. IUMRS (International Union ...
Mechanical and microstructural properties of SiC-mixed Sn-Bi...
www.infona.pl
SiC-nanoparticle-mixed Sn58Bi solders were successfully produced by electroplating and the mechanical and microstructural properties of Sn58Bi+SiC solders were...
Reliability of various Pb-free solders under vibration and elevated...
www.infona.pl
2011 IEEE 13th Electronics Packaging Technology Conference Yong-Ho Ko, Young-Kyu Lee, Sehoon Yoo, Chang IEEE 13th Electronics Packaging …
Distinguished Alumnus | College of Engineering Awards
legacy.engineering.osu.edu
Sehoon Yoo MSE PhD Yoni Adonyi WE MS 86, PhD Robert J. Borel . EE 65, ... KSA Distinguished Alumnus 100 Anniversary Awardee: Larch 61
Joint properties of Au stud bumps joined with Sn-3.5Ag solder by flip...
www.infona.pl
Joint properties of Au stud bumps joined with Sn-3.5Ag solder by flip chip bonding were investigated Sehoon Yoo, Chang-Woo Lee. Details; Contributors; Bibliography;
Contents - Nanostructured Materials - Texas Powerful Smart
www.texaspowerfulsmart.com
One-Dimensional Nanostructured Ceramics for Healthcare, Energy 3 and Sensor Applications S. Ramakrishna, Ramakrishnan Ramaseshan, Rajan Jose, Uao Susan,
Effects of surface finishes and current stressing on the interfacial...
www.infona.pl
... stressing on the interfacial reaction characteristics of Sn–1.2Ag–0.7Cu–0.4In solder bumps. Sung-Hyuk Kim, Jae-Myeong Kim, Sehoon Yoo, Young-Bae Park.
Journal Sensors and Actuator B: Chemical, 108, 1-2
www.sensorsportal.com
Sensors and Actuators journal B: Chemical: contents
OUCI
ouci.dntb.gov.ua
Видавець: Springer Science and Business Media LLC. Автори: Jae-Myeong Kim, Myeong-Hyeok Jeong, Sehoon Yoo, Young-Bae Park ...
TiO2–SnO2 nanostructures and their H2 sensing behavior
www.infona.pl
Pure TiO and mixed oxide samples of TiO and SnO sintered samples having different surface areas were synthesized using a...
Void fraction of a Sn–Ag–Cu solder joint underneath a chip ...www.springerprofessional.de › void-fraction-of-a-sn-ag-cu-solder-joi...
www.springerprofessional.de
Journal: Journal of Materials Science: Materials in Electronics > Issue Authors: Wonil Seo, Yong-Ho Ko, Young-Ho Kim, Sehoon Yoo.
화학공학소재연구정보센터(CHERIC) | 연구정보 | 문헌DB | 학술지 검색
www.cheric.org
Sung-Hyuk Kim, Byeong-Rok Lee 1, Jae-Myeong Kim 2, Sehoon Yoo 3, and Young-Bae Park 1, †. Nepes Corporation, Ochang , Korea; 1School of ...
Past Recipients | MRS Graduate Student Awards
www.mrs.org
List of past MRS graduate student award winners dating back to 2001
플립칩 본딩용 접착제 특성에 미치는 촉매제의 영향www.cheric.org › tech › periodicals › view
www.cheric.org
Kyung-Eun Min 1, 2, Jun-Sik Lee 1, Sehoon Yoo 1, Mok-Soon Kim 2, and Jun Ki Kim 1, †. 1Advanced Welding & Joining Technology Center, KITECH, ...
Scilit | Article - Effect of Plasma Surface Finish on Wettability and...
www.scilit.net
Kyoung-Ho Kim, Junichi Koike, Jeong-Won Yoon, Sehoon Yoo. Published: 6 September by Springer. in Journal of Electronic Materials. Journal of ...
Yoo, Incheon - Patent applications
www.patentsencyclopedia.com
Sehoon Yoo, Incheon KR. Patent application number, Description, Published , APPARATUS FOR FILLING A WAFER VIA WITH SOLDER AND ...
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