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	Design Diodes IBM Chip Scale Reliability Package Wafer-Level Flip Chip Lead-Free LED Devices Assembly Failure Analysis Packaging

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Actel Introduces New Chip-Scale Packages for eX Family of ...

www.design-reuse.com

Actel Introduces New Chip-Scale Packages for eX Family of FPGAs. SUNNYVALE, Calif., May 29 /PRNewswire/ -- Underscoring its commitment to leading-edge ...

Chip scale packages: The small packaging expert of Fraunhofer IMS -...

www.ims.fraunhofer.de

The various strengths of the chip scale packages are in the manner of manufacturing. The Fraunhofer IMS applies the cover with a ...

White-chip scale packages cut costs by 80 percent

www.eenewseurope.com

SemiLEDs Corporation has announced sampling and mass production availability of the company's white chip scale packages, the ...

Chip-Scale Packages and Their Failure Analysis Challenges -...

www.asminternational.org

... for smaller, feature-rich electronic devices will continue for many years. In response, the demand for Chip-Scale Packages (CSPs) has grown tremendously.

Interests

TESSERA/INTEL TO DEVELOP STACKED CHIP-SCALE PACKAGES

connection.ebscohost.com

TESSERA/INTEL TO DEVELOP STACKED CHIP-SCALE PACKAGES. PUB. DATE. July SOURCE. Electro Manufacturing;Jul2001, p2. SOURCE TYPE.

Private Homepages

Contactors test wafer level chip scale packages

www.electronicspecifier.com

By adding the Gemini Kelvin 050 for 0.5mm pitch contacting Multitest continues to address the expanding requirements of its customers testing ...

Property

WO SINGULATION SYSTEM FOR CHIP-SCALE PACKAGES

patentscope.wipo.int

This patent search tool allows you not only to search the PCT database of about 2 million International Applications but also the worldwide patent collections....

Books & Literature

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Area Array Interconnection Handbook - Google Books

books.google.co.uk

Microelectronic packaging has been recognized as an important

Failure Modes and Mechanisms in Electronic Packages - P. Singh,...

books.google.co.uk

Those of us who grew up in the

Implementing IBM Spectrum Scale - Dino Quintero, Puneet Chaudhary,...

books.google.co.uk

Installing IBM Spectrum Scale packages Installing IBM Spectrum packages is 38 Implementing IBM Spectrum Scale Preparing the environment - installing ...

Microelectronics Failure Analysis: Desk Reference - EDFAS Desk...

books.google.co.uk

Includes bibliographical references and index.

Scientific Publications

Chip Scale Packages - an overview | ScienceDirect Topics

www.sciencedirect.com

These are called chip-scale packages (CSP) and are defined as packages that are no larger than 1.5 times the area of the die or no more than 1.2 times the width or length of the die. If the carrier is a BGA type, an alternate definition is that the solder-ball pitch be less than 1 mm.

FreiDok plus - Zuverlässige Montagetechnik für Baugruppen mit Chip...

freidok.uni-freiburg.de

Zuverlässige Montagetechnik für Baugruppen mit Chip Scale Packages : Schlußbericht für den Zeitraum: bis Erstellungsjahr:

Publications

Effect of Thermal Aging on Drop Performance of Chip Scale Packages...

link.springer.com

Because of the trend of miniaturization, the drop performance of portable electronic devices is becoming increasingly critical. This study was focused on t

Chip Scale Package Assembly Reliability | SpringerLink

link.springer.com

Emerging chip scale packages (CSPs) and miniature versions of ball grid arrays (BGAs), are competing with bare die flip chip assemblies. CSP is an important ...

Moisture Sensitivity Investigations of 3D Stacked-Die Chip-Scale...

link.springer.com

Stacked-Die Chip-Scale Packages (SCSPs). X.Q. Shi, X.J. Fan, and B. Xie Introduction. The development of three-dimensional (3D) microelectronic ...

Reports & Statements

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Google Groups: Chip Size/Scale Packages

: .il sci engr semiconductors I am interested to know if

Wikipedia: Chip-scale package - Wikipedia

Chip scale packages can be classified into the following groups: Customized leadframe-based CSP; Flexible substrate-based CSP; Flip-chip CSP (FCCSP)

Wikipedia: Ibiden – Wikipedia

... für die besonders kompakt gestalteten HDI-Leiterplatten sowie fcCSP-Substrate für Chip Scale Packages. Ibiden verwendet hierbei die ...

Wikipedia: List of integrated circuit packaging types - Wikipedia

List of integrated circuit packaging types. A standard-sized 8-pin dual in-line package (DIP) containing a 555 IC. It ... Chip-Scale packages

Miscellaneous

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Stacked-die Chip-Scale Packages :Parylene protective ...

www.linkedin.com

[0004]This problem is exacerbated by the industry trend toward stacked-die chip-scale packages (SCSPs) to provide higher performance while ...

US B1 - Chip scale packages and methods for manufacturing the...

patents.google.com

1. Field of the Invention. This invention relates to chip scale packages and methods for manufacturing the packages at wafer level. 2. Description of Related Art.

US B1 - Method for making chip scale packages Google...

patents.google.com

The present invention is a chip scale package handling part and process manufacturing method that uses existing automated equipment to economically mass...

US A1 - Chip-scale packages Google Patents

patents.google.com

Improved chip-scale packages wherein semiconductor die side surfaces are free of the material defects associated with prior art chip-scale package...

Chip Scale Packages in Wearables | Silicon Labs

pages.silabs.com

Chip Scale Packages in Wearable Technology. Decades of consumer electronic product development have resulted in countless devices used for every purpose, from ...

Chip scale packages: Lumileds debuts new LED, Plessey integrates...

www.ledsmagazine.com

Lumileds has announced its CSP-based FlipChip White LED intended for general illumination applications, while Plessey has developed a way to customize primary...

Conference Proceedings - ASM International

www.asminternational.org

Provide an overview of Chip Scale Packages (CSP), including Multi-Chip Packages (MCP). Understand the challenges that CSP creates for failure analysis.

Chip-scale package - Wikiwand

www.wikiwand.com

Chip scale packages can be classified into the following groups: Customized leadframe-based CSP (LFCSP); Flexible substrate-based CSP; Flip-chip CSP ...

US B2 - Stack package made of chip scale packages

patents.google.com

A stack package of the present invention is made by stacking at least two area array type chip scale packages. Each chip scale package of an adjacent...

US A1 - Isolation structures for CMOS image sensor chip...

patents.google.com

Isolation structure for CMOS image sensor device chip scale packages and fabrication methods thereof. A CMOS image sensor chip scale package includes a...

US A1 - Method for fabricating wafer-level chip scale...

patents.google.com

A method for fabricating wafer-level chip scale packages is disclosed. A plurality of sacrificial photoresists with supporting surfaces in strip or bump...

Chip Scale Packages - cenogent

cenogent.com

Chip Scale Packages are less costly, but they require much more attention and higher technological capabilities on the assembly side, and potentially present ...

Designing and Qualifying Chip-Scale Packages - DfR Solutions

www.dfrsolutions.com

Designing and Qualifying Chip-Scale Packages. By Craig Hillman, Nathan Blattau [DfR Solutions]. Download PDF. The continued evolution in semiconductor ...

EMI Filters boast 0.4-mm chip-scale packages - Embedded.com

www.embedded.com

EMI Filters boast 0.4-mm chip-scale packages. September 13, Richard Nass. California Micro Devices introduced a new family of Centurion-based EMI ...

US A1 - Environmental die seal enhancement ...

patents.google.com

... caused by moisture, contamination, and stress induced defects such as cracks and delamination when incorporated into wafer level chip scale packages.

Plasma Cleaning of Chip Scale Packages for Improvement of Wire Bond...

www.tib.eu

Plasma Cleaning of Chip Scale Packages for Improvement of Wire Bond ... Cleaning Issues Related to Flip Chip, Ball Grid Array and Chip Scale Packages.

Wafer Level Chip Scale Packages | Hardware Design Articles ...

www.eeweb.com

Wafer level chip scale packages allow direct connection, without wires, to a printed circuit board by inverting the die and connecting by solder ...

"Stress Analysis for Chip Scale Packages with Embedded Active Devices...

pdxscholar.library.pdx.edu

In the present study, the stress of chip scale packages (CSP) with an embedded die under thermal cycling conditions is evaluated using the ...

Online Store

electricfenceaustralia.com.au

Store categories. Electric fence manuals; Electric fence kits. Solar powered electric fence kits; Battery powered electric fence kits; Mains powered ...

ELECTRONIC DEVICE WAFER LEVEL SCALE PACKAGES AND FABRICATION METHODS...

www.patentsencyclopedia.com

Electronic device wafer level scale packages and fabrication methods thereof A semiconductor wafer with a plurality of electronic devices ...

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