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UTAC THAI LIMITED, Bangkok, TH, US
Books & Literature
Tables of Contents for Proceedings 47th Electronic Components &...
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Saravuth Sirinorakul, NS Electronics Solder Joint Formation Simulation and Finite Element Analysis Gary K. Mui Xiaohua Wu Kai X. Hu Chao-Pin Yeh Karl Wyatt, Motorola High Temperature Deformation of Area Array Packages by …
Related Documents
Lead frame land grid array - Utac Thai Limited
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A package includes a first plated area, a second plated area, a die attached to the first plated area, and a bond coupling the die to the second plated area....
Molded leadframe substrate semiconductor package - UTAC THAI LIMITED
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A process for forming an optical package comprises at least partially encasing a first leadframe strip in a first mold compound thereby forming a molded...
Method and apparatus for no lead semiconductor package ...www.freepatentsonline.com › ...
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,961, filed Nov. 5, 2007, Saravuth Sirinorakul et al. Notice of Allowance dated Dec. 2, 2009, U.S. Appl. No ,677, filed Apr. 4, 2008, ...
Singulation method for semiconductor package with plating on side of...
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A method of singulating semiconductor packages, the method comprising: providing a plurality of semiconductor dies coupled to a single common leadframe,...
Miscellaneous
US A1 - Protruding terminals with internal routing...
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A semiconductor package includes terminals extending from a bottom surface of the semiconductor package, and a layer of interconnection routings disposed...
Saravuth Sirinorakul, Bangkok TH - Patent applications
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Patent application number Description Published; : FLIP-CHIP LEADFRAME SEMICONDUCTOR PACKAGE - A flip-chip leadframe semiconductor …
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC...
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29 Characterization of Dicing Tape Adhesion for Ultra-thin Die Pick-up Process Jun Dimaano, Saravuth Sirinorakul and Nathapong Suthiwongsunthorn Novel ...
Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON...
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... its optimization Kyaw Ko Lwin, Carolyn Epino Tubillo, Panumard T., Jun Dimaano, Dr. Nathapong Suthiwongsunthorn, Saravuth Sirinorakul United Test and.
LEADFRAME BASED MULTI TERMINAL IC PACKAGE - Patent application
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Patent application title: LEADFRAME BASED MULTI TERMINAL IC PACKAGE Inventors: Saravuth Sirinorakul (Bangkok, TH) Assignees: UTAC THAI LIMITED IPC8 Class: AH01L23495FI USPC Class: Class name: Active solid-state devices (e.g ...
Technical Publications - UTAC
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Kyaw Ko Lwin, Carolyn Epino Tubillo, Panumard T., Jun Dimaano, Dr. Nathapong Suthiwongsunthorn, Saravuth Sirinorakul. 18th Electronics Packaging Technology ... › resources › technical-pub...
IMAPS 2014, San Diego - Technical Programwww.imaps.org › imaps2014 › program
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Lee Smith, UTAC (Saravuth Sirinorakul, Jun Dimaano). 6:00 PM - 6:25 PM. CO2 Spray Cleaning and OSEE Non-Contact Surface Inspection for Wire Bond Pad ...
[PDF] New Generation Routable QFN for Power SiP Applications |...
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... Attard and John Abela and Keith H. Edwards and Lee Smith and Angus C.C. Lam and Saravuth Sirinorakul and Kyaw Ko Lwin and Lock Kok Chuen}, year={2019} }. › paper › New-Generatio...
guidelines for printed circuit board assembly (pcba) of utac ...
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... Ang Choon Ghee, Nathapong Suthiwongsunthorn, Saravuth Sirinorakul United Test and Assembly Center Ltd Singapore * ABSTRACT Over the past 17 years, ... › Guidelines-for-printe...
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