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Invensas BVA技术：新一代移动设备堆叠封装解决方案 - 21ic中国电子网
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Invensas 产品工程副总裁Phil Damberg 表示：“移动设备目前面临的挑战是它们都需要支持高分辨率屏幕、实时下载、高清晰度、3D， 和需要处理器 ...
Invensas推出新一代智能手机和平板电脑堆叠封装解决方案 - 新品推荐 - 行业资讯==www.ic37.com
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Invensas推出新一代智能手机和平板电脑堆叠封装解决方案
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