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	Hungary Huntersville

	Giles Humpston

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LinkedIn: Osher Avsian - Program Manager - Tessera | LinkedIn

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Osher Avsian - Patents

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Osher Avsian patents Recent bibliographic sampling of Osher Avsian patents listed/published in the public domain by the USPTO (USPTO Patent Application #,Title):

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DIGITALOPTICS CORPORATION EUROPE LIMITED

Osher Avsian | Huntersville, North Carolina

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Osher Avsian | LinkedIn

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Osher Avsian | LinkedIn

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Patent US Wafer level packaging to lidded chips ...

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Osher Avsian, Robert Burtzlaff, Avi Dayan, Andrey Grinman, Felix Hazanovich, ...

WO A3 - Wafer level chip packaging Google Patents

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Patents Publication number: WO A3: Publication type ... Giles Humpston, Michael J Nystrom, Osher Avsian, Robert Burtzlaff, Mitchell Hayes Reifel ...

WO A2 - Stacked microelectronic assemblies having vias...

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Moshe Kriman, Osher Avsian, Belgacem Haba, Giles Humpston, Dmitri Burshtyn: Aanvrager: Tessera Technologies Hungary Kft. Citatie exporteren: BiBTeX, EndNote, …

David Ovrutsky assignee Patents | 92 assignee related Patents ...

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Michael J Nystrom, Osher Avsian, Robert Burtzlaff, Mitchell Hayes Reifel; January 03, ...

Optical Imaging Apparatus And Methods Of Making The Same - Patent...

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Inventors: Moshe Kriman (Charlotte, NC, US) William Hudson Welch (Charlotte, NC, US) Giles Humpston (San Jose, CA, US) Osher Avsian (Huntersville,

Run Wild 5K 5K Run

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Mooresville NC: 611: 11: 104: 27:43.3: 27:58.9: 8:55/M: 10: Matthew Pertgen: Huntersville NC: 816: 11: 123: ... Osher Avsian: Huntersville NC: 585: 41: 70: 25:18.4

EP A2 - Stack packages using reconstituted wafers

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Buluş Sahipleri, Osher Avsian, Andrey Grinman, Giles Humpston, Moti Margalit. Başvuru sahibi, Tessera Technologies Hungary Kft. Alıntıyı Dışa Aktar, BiBTeX, ...

US A1 - Stacked microelectronic assemblies having vias...

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A stacked microelectronic assembly is provided which includes first and second stacked microelectronic elements. Each of the first and second...

WO A2 - Wafer level packaging to lidded chips

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Inventores, Giles Humpston, Michael J Nystrom, Vage Oganesian, Yulia Aksenton, Osher Avsian, Robert Burtzlaff, Avi Dayan, Andrey Grinman, Felix Hazanovich ...

STACKED MICROELECTRONIC ASSEMBLIES HAVING VIAS EXTENDING THROUGH BOND...

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Patent application title: STACKED MICROELECTRONIC ASSEMBLIES HAVING VIAS EXTENDING THROUGH BOND PADS Inventors: Moshe Kriman (Charlotte, NC, US) Osher Avsian

Run Wild 5K and Wild Child Fun Run - Find a Participant

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Osher Avsian Is this you? Run Wild 5K Run/Walk, M, 41, Huntersville, NC US. Julia Ayers Is this you? Run Wild 5K Run/Walk, F, 30, Matthews ...

US B2 - Patent for a Stack Packages Using Reconstituted...

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Inventors (applicants): Giles Humpston, Andrey Grinman, Moti Margalit, Osher Avsian. Assignees (initial): Tessera, Inc. (San Jose, US). Agents: Lerner, David ...