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www.ieee-csj.org › historyICSJ2016
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Minoru Ueshima (Senju Metal Industry Co., Ltd.) Tomoyuki Hatakeyama (Toyama Prefectural University), Masahiro Inoue (Gunma University). Shigenori Aoki ...
Wipo Publishes Patent of Senju Metal Industry, Ueshima Minoru and...
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GENEVA, Feb Publication No. WO was published on Feb. 13.Title of the... | Article from US Fed News Service, Including US State News February...
Telephone & Addresses
Minoru Ueshima, Honolulu, South St
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Interests
Minoru Ueshima - Patents
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Recent bibliographic sampling of Minoru Ueshima patents listed/published in the public domain by the USPTO (USPTO Patent Application #,Title): ...
Business Profiles
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SENJU METAL INDUSTRY CO., LTD., Matsudo, JP
Books & Literature
Minoru Ueshima | XanEdu Customization Platform
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Author: Minoru Ueshima. Results. Effects of reflow atmosphere and flux on Sn whisker growth of Sn–Ag–Cu solders Springer Science+Business Media ...
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Wanli Li, Cai-Fu Li, Fengpei Lang, Jinting Jiu, Minoru Ueshima, Hao Wang, Zhi-Quan Liu and Katsuaki Suganuma. Self-catalyzed Cu–Ag inks are developed to ...
Related Documents
Published patent and design registration information december 27th,…
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Minoru Ueshima - researchr alias
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Publications by 'Minoru Ueshima'. Publications; Advised. No publications in this list. About · Contact · Credits · Help · Web Service API · Blog · FAQ · Feedback.
daneshyari.com › article › previewA novel low-temperature solder based on intermetallic ...
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Minoru Ueshima c. , Jun Sugimoto c a Technology and Manufacturing Group, Intel Corporation, Chandler, Arizona , United States.
EBSCOhost | | Effects of reflow atmosphere and flux on Sn...
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Minoru Ueshima. Received: 19 November Accepted: 5 March Published online: 16 March Ó Springer Science+Business Media, LLC
Publications
Publications Authored by Minoru Ueshima | PubFacts
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Publications Authored by Minoru Ueshima
A novel low-temperature solder based on intermetallic-compound...
link.springer.com
A novel low-temperature solder that consists entirely of two phases of intermetallic compounds has been developed as a reliable low-temperature interconnect....
Numerical prediction of fraction of eutectic phase in Sn−Ag−Cu...
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A combination of macroscale solidification simulation and phase-field calculation is employed to predict the volume fraction of the eutectic phase in Sn-4.
Effects of reflow atmosphere and flux on Sn whisker growth of...
link.springer.com
Alongheng Baated; Keun-Soo Kim; Katsuaki Suganuma; Sharon Huang; Benjamin Jurcik; Shigeyoshi Nozawa; Minoru Ueshima. We evaluated the Sn whisker ...
Video & Audio
minoru ueshima - YouTube
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Reports & Statements
Lead-Free Wave Defects
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Lead-Free Wave Defects printed circuit board assembly, surface mount technology and electronics manufacturing forum discussions.
Miscellaneous
EP A4 - In-containing lead-free solder for on-vehicle...
patents.google.com
Other languages: German: French; Inventor: Yuji Kawamata: Minoru Ueshima: Tomu Tamura: Kazuhiro Matsushita: Masashi Sakamoto; Current Assignee.
EP A8 - Lead free solder Google Patents
patents.google.com
A lead-free solder includes mass % of Ag, mass % of Cu,
at least one of P, Ge, Ga, Al, and Si in a total amount of mass...
EP A8 - Bleifreies Weichlot Google Patents
patents.google.com
A lead-free solder includes mass % of Ag, mass % of Cu, at least one of P, Ge, Ga, Al, and Si in a total amount of mass %, and...
Minoru Ueshima Details / Explore| NAVITIME Travel - Japan Travel ...
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Detailed information for Minoru Ueshima. Pictures, maps, detailed information, related articles, and nearby sightseeing spots and restaurants are available for ...
Minoru Ueshima
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Search results for: Minoru Ueshima ... Kiju Lee, Katsuaki Suganuma, Keun-Soo Kim, Minoru Ueshima, more · 18th European Microelectronics ...
Minoru Ueshima, Chiba JP - Patent applications
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Patent application number, Description, Published , Soldering Method, Solder Pellet for Die Bonding, Method for Manufacturing a Solder Pellet for ...
www.google.com.pg › patentsUS B2 - Lead-free solder alloy - Google Patents
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US A1 * Minoru Ueshima Soldering Method, Solder Pellet for Die Bonding, Method for Manufacturing a Solder Pellet for ...
www.google.mk › patentsPatent US Lead-free soft solder - Google Patents
patents.google.com
... mobile devices in emergency situations. US *, 3 Mar 2009, 19 May 2011, Minoru Ueshima, Lead-free solder connection structure and solder ball ...
EP A4 - Pouring apparatus for molten metal and casting method...
patents.google.com
A pouring apparatus for molten metal includes a stirrer installed in a reservoir. The stirrer is rotated by a rotational drive mechanism installed on the...
Effects of reflow atmosphere and flux on Sn whisker growth of...
www.chemeurope.com
Benjamin Jurcik, Shigeyoshi Nozawa, Minoru Ueshima.
pubs.rsc.org › Content › ArticleLandingSelf-catalyzed copper–silver complex inks for low-cost ...
pubs.rsc.org
Wanli Li,*ab Cai-Fu Li,b Fengpei Lang,bc Jinting Jiu,*bdMinoru Ueshima,d Hao Wang,bc Zhi-Quan Liube and Katsuaki Suganumab. Author affiliations.
EP B1 - Bi-Sn-BASED HIGH-TEMPERATURE SOLDER ALLOY
patents.google.com
Inventors, Minoru Ueshima, Yoshimi Inagawa, Minoru Toyoda. Applicant, Senju Metal Industry Co., Ltd. Export Citation, BiBTeX, EndNote, RefMan. Non-Patent ...
EP A4 - Lead-free solder alloy suppressed in occurrence of...
patents.google.com
... EP , EP , EP A4, EP A4. Erfinder, Yuji Kawamata, Minoru Ueshima, Min Kang, Kayako Nakagawa, Yasuaki Kokubu.
US A1 - Method of regulating nickel concentration in...
patents.google.com
US *, 14 Jun 2004, 13 Jan 2005, Minoru Ueshima, Method for increasing the effectiveness of a component of a material ...
trea.com › organization › senju-metal-industry-co-ltd › informationSenju Metal Industry Co., Ltd. | TREA
trea.com
Senju Metal Industry Co., Ltd. Minoru Ueshima. H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR. Information Patent Grant ...
web.calce.umd.edu › symposiums › ISTW2009International Symposium on Tin Whiskers (2009)
web.calce.umd.edu
Minoru Ueshima, Senju Metals. Day I-Session III. Tin Whisker and Surface Defect Formation on Electroplated Films and Reflowed Joints Prof. Carol Handwerker ...
www.acronymattic.com › Senju-Metal-Industry-Co-(SMIC)SMIC - Senju Metal Industry Co | AcronymAttic
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View Minoru Ueshima's business profile at Senju Metal Industry Co., Ltd. and see work history, affiliations and more. Senju Metal Industry Co Ltd from japan.
EP A4 - Lead-free solder joint structure and solder ball...
patents.google.com
Solder used for flip chip bonding inside a semiconductor package was a Sn-Pb solder such as a Pb-5Sn composition. Lead-free solders which have been...
US A1 - Indium-containing lead-free solder for...
patents.google.com
US Application. Download PDF Find Prior Art Similar. Other languages: English; Inventor: Yuji Kawamata: Minoru Ueshima: Tomu Tamura: Kazuhiro Matsushita ...
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