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Future Directions in IC and Package Design Workshop, FDIP’04
ewh.ieee.org
... in High-Speed Interconnects and Packaging Engineering, Sergio Camerlo, Cisco Systems • Analog RF CMOS and Optical Design Techniques for 10+ Gbps Datacom, Martin Schmatz
Untitled Document
www.ewh.ieee.org
The third talk was presented by Martin Schmatz of IBM Corporation and was entitled Analog RFCMOS and Optical Design Techniques for 10+ Gbps Datacom.
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