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Flip-Chip-Gehäuse für Kupfer/Low-k-Halbleiterprozesse von LSI Logic...
www.pressebox.de
LSI Corporation, System-on-Chip-Produkte wie Gflx und die RapidChip-Plattform nutzen die Vorteile der Sub-Mikron-Halbleitertechnologie un…
LSI ready with flip-chip packaging on low-k | EDN
www.edn.com
LSI maintains a large packaging engineering group, headed by Maniam Alagaratnam, an LSI vice president. Last year, LSI announced it had figured out how to ...
Underfill Material is formulated for flip chip packaging.
news.thomasnet.com
Underfill Material is formulated for flip chip packaging. - Sep 25, Henkel Corporation
The Package | EDN
www.edn.com
EDN is a leading source for reliable electronics design ideas, articles, how to articles and teardowns. Read EDN.com for the latest information on analog...
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