Maniam Alagaratnam

	Cupertino Bay Francisco

	President Semiconductor Packaging Flip Chip Francisco Bay Area San Francisco Bay Assignee Key Role LSI Logic's Package Patent

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Flip-Chip-Gehäuse für Kupfer/Low-k-Halbleiterprozesse von LSI Logic...

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LSI Corporation, System-on-Chip-Produkte wie Gflx und die RapidChip-Plattform nutzen die Vorteile der Sub-Mikron-Halbleitertechnologie un…

LSI ready with flip-chip packaging on low-k | EDN

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LSI maintains a large packaging engineering group, headed by Maniam Alagaratnam, an LSI vice president. Last year, LSI announced it had figured out how to ...

Underfill Material is formulated for flip chip packaging.

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Underfill Material is formulated for flip chip packaging. - Sep 25, Henkel Corporation

The Package | EDN

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EDN is a leading source for reliable electronics design ideas, articles, how to articles and teardowns. Read EDN.com for the latest information on analog...

Telephone & Addresses

Maniam B Alagaratnam, Cupertino, US, Dempster Ave

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Interests

Maniam Alagaratnam - Patents

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Recent bibliographic sampling of Maniam Alagaratnam patents listed/published in the public domain by the USPTO (USPTO Patent Application #,Title): ...

CISCO's Brillwater to Keynote at Global Business Council’s Spring...

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Brillhart heads a stellar line-up that includes E. Jan Vardaman, President, TechSearch International, Maniam Alagaratnam, VP of Package Development, LSI Logic, Bill McClean, President, IC Insights, Dr. Jonathan Harris, President, CMC Interconnect, Lee Smith, Senior Director of Business Development, ...

Management & Stakeholders

Maniam Alagaratnam - MarketVisual Knowledge Map

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New Search: Maniam Alagaratnam. Maniam Alagaratnam. Knowledge Map Preview. Company Affiliations. Search: Company, # of Roles. Lsi Logic Corp, 3.

Maniam B Alagaratnam - MarketVisual Knowledge Map

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Current Affiliations. Executive. VICE PRESIDENT at Lsi Corp. Package Development. Past Affiliations. Executive. VICE PRESIDENT at Lsi Corp. of Package ...

Business Profiles

patentbuddy: Maniam Alagaratnam

INVENSAS CORPORATION

patentbuddy: Maniam B Alagaratnam

LSI LOGIC CORPORATION

Books & Literature

USPTO Image File Wrapper Petition Decisions Google Books

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... CA; John P. McCormick, Palo Alto, CA; Maniam Alagaratnam, Cupertino, CA; Domestic Priority data as claimed by applicant Foreign Applications If Required, ...

Official Gazette of the United States Patent and Trademark ...

books.google.de

GRID ARRAY CIRCUITS Kishor V. Desai, Fremont; Maniam Alagaratnam, Cupertino, and Sunil A. Patel, Los Altos, all of Calif., assignors to LSI Logic ...

Publications

SMTA announces Pan Pacific Symposium program, keynotes. - Free Online...

www.thefreelibrary.com

Also featured are three keynote addresses: "Flip Chip Packaging--Current Trends and Roadmap," presented by Maniam Alagaratnam, LSI Logic; "A Key Role of PCB in Recent Packaging Solutions," by Yutaka Tsukada, Kyocera SLC Technologies; and "Technical Challenges in Memory Packaging," by Se Yong Oh , ...

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Maniam Alagaratnam | Professional Profile - LinkedIn

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View Maniam Alagaratnam's professional profile on LinkedIn. LinkedIn is the world's largest business network, helping professionals like Maniam Alagaratnam discover inside connections to recommended job candidates, industry experts, and business partners.

EP A2 - Thin power tape ball grid array package ...

patents.google.com

Other languages: German: French; Inventor: Maniam Alagaratnam: Chok J. Chia: Patrick Variot; Current Assignee. The listed assignees may be inaccurate.

EP A3 - Google Patentspatents.google.com › patent

patents.google.com

Download PDF Find Prior Art Similar. Other languages: German: English: French; Inventor: Maniam Alagaratnam: Chok J. Chia: Patrick Variot; Current Assignee.

Patent US Test fixture for flip chip ball grid array ...

patents.google.com

Inventors, Kishor V. Desai, Maniam Alagaratnam, Sunil A. Patel. Original Assignee, Lsi Logic Corporation. Export Citation, BiBTeX, EndNote, ...

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Maniam Alagaratnam | Avago Technologies | Email Vice President |...

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Email, phone number & executive profile for Maniam Alagaratnam, Vice President of Avago Technologies at San Francisco, CA

EX

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LSI LOGIC CORPORATION ("LSI") By: /s/ Maniam Alagaratnam Name: Maniam Alagaratnam Title: Vice ...

EP A2 - Boítier de puissance mince de type grille de boule à...

patents.google.com

An integrated circuit package includes a heat-spreader which is formed to have a centrally disposed recessed portion between planar surfaces, and flex tape...

US A - Semiconductor die having sacrificial bond pads for die...

patents.google.com

The testing of integrated circuits in a plurality of dice arranged in rows and columns in a semiconductor wafer is facilitated by effectively increasing...

WO A1 - Boitier a matrice de grille utilisant des billes de...

patents.google.com

... WO A1, WO A1, WO A1, WO A1 , WO A1. Inventors, Chok J Chia, Patrick Variot, Maniam Alagaratnam.

Sydex.net: People Search | William Ivey, Toni Wokeme, Daryl & Pat...

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People search: find Photos, Location, Education, Job!

Chok J Chia from Prado Vista Ave, Cupertino, CA ...

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Maniam Alagaratnam - Cupertino CA. Assignee: LSI Logic Corporation - Milpitas CA. International Classification: B65D H01L US Classification:.

Intarsia advances RF design with seamless simulation | Semiconductor...

sst.semiconductor-digest.com

There were two co-recipients in Maniam Alagaratnam of LSI Logic was recognized for pioneering and successfully qualifying high-performance flip-chip ...

US A - Snap on heat sink attachment Google Patents

patents.google.com

Inventors, Patrick Variot, Qwai H. Low, Maniam Alagaratnam, Teresa Dalao. Original Assignee, Lsi Logic Corporation. Export Citation, BiBTeX, EndNote, RefMan.

WO A1 - Ball grid array package employing solid core solder...

patents.google.com

Inventors, Chok J Chia, Patrick Variot, Maniam Alagaratnam. Applicant, Lsi Logic Corp, Chok J Chia, Patrick Variot, Maniam Alagaratnam.

Semiconductor Digest | News and Industry Trends

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MEPTEC is adding LSI Logic's VP of packaging design and development, Maniam Alagaratnam, as the keynote speaker for its next one-day technical ...

LSI Logic licenses package technology to Amkor - EE Times

www.eetimes.com

... LSI Logic's packaging technology as the industry standard," said Maniam Alagaratnam, LSI Logic's vice president of package development.

SEMICON West TechXPOT Offers Focus on Test, Assembly and Packaging...

prod7.semi.org

... director of packaging technology at Altera; ASICs Packaging Roadmap, featuring Maniam Alagaratnam, vice president of package development at LSI Logic; ...

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