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News
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Targeted News Service provides Washington Bureau coverage, federal contract and contracting information for awards and for subcontracting opportunities, a...
Telephone & Addresses
Kejun Zeng, 59, Coppell, Bricknell Ln
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Network Profiles
LinkedIn: Kejun Zeng | LinkedIn
Visa Kejun Zengs yrkesprofil på LinkedIn. LinkedIn är världens största yrkesnätverk och hjälper yrkespersoner som Kejun Zeng att komma i kontakt med ...
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Kejun Zeng is on Facebook. Join Facebook to connect with Kejun Zeng and others you may know. Facebook gives people the power to share and makes the ...
Interests
Kejun ZENG - Patents
www.freshpatents.com
... ZENG patents. Recent bibliographic sampling of Kejun ZENG patents listed/published in the public domain by the USPTO (USPTO Patent Application #,Title): ...
Business Profiles
patentbuddy: Kejun ZENG
TEXAS INSTRUMENTS INCORPORATED, Coppell, TX, US
Books & Literature
Copper Wire Bonding - Preeti S Chauhan, Anupam Choubey, ZhaoWei...
books.google.lv
This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and...
Solder Joint Technology: Materials, Properties, and Reliability -...
books.google.lv
Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July...
Thermodynamics, Diffusion and the Kirkendall Effect in Solids - Aloke...
books.google.fi
In this book basic and some more advanced thermodynamics and phase as well as stability diagrams relevant for diffusion studies are introduced. Following,...
Related Documents
Epoxy flux a low cost high reliability approach for pop assembly-ima…
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Epoxy Flux A Low Cost High Reliability Approach for PoP Assembly Dr. Ning-Cheng Lee …
www.otalib.fi
www.otalib.fi
t= kejun zeng. t= kekkonen timo. t= kelha vaino ed. t= kelleher patrick. t= kemppainen kajola pia
Publications
Foreword | SpringerLink
link.springer.com
Kejun Zeng (5) Author Affiliations. 1. Beijing University of Technology, Beijing, China 2. Purdue University, West Lafayette, USA ...
Investigation of the nitrogen-nickel-titanium system: The isothermal...
rd.springer.com
Phase relations in the ternary system N-Ni-Ti have been established experimentally for the 900 °C isothermal section assisted by thermodynamic modeling. Phase...
Lead-free soldering: Materials science and solder joint reliability |...
link.springer.com
Kejun Zeng is a senior packaging engineer with Texas Instruments in Dallas, Texas and is the advisor to JOM from the Electronic Packaging ...
Reports & Statements
Google Groups: Conference
: Kejun Zeng -- Institute of Materials Research Phone: +49-(0) GKSS
Google Groups: Tamman Temperature
: Kejun Zeng -- Laboratory of Electronics Production Technology Dept. of Electrical
Google Groups: Lufthansa
: Kejun Zeng misc invest stocks It was reported that the
Google Groups: more news groups
: ... news newusers questions Dr. Kejun Zeng wrote: Hi
Miscellaneous
Kejun Zeng | LinkedIn
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View Kejun Zeng’s professional profile on LinkedIn. LinkedIn is the world's largest business network, helping professionals like Kejun Zeng discover inside ...
KeJun Zeng - Student - Temasek Polytechnic | LinkedIn
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View KeJun Zeng's profile on LinkedIn, the world's largest professional community. KeJun has 4 jobs listed on their profile. See the complete profile on LinkedIn ...
Kejun Zeng - Packaging reliability - Texas Instruments | LinkedIn
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View Kejun Zeng's profile on LinkedIn, the world's largest professional community. Kejun has 1 job listed on their profile. See the complete profile on LinkedIn ...
EP A1 - Improvements in or relating to the bulk production of...
patents.google.com
US A1 * Kejun Zeng Thermal fatigue resistant tin-lead-silver solder. * Cited by examiner, † Cited by third party, ‡ Family to ...
US A - Non-corrosion solder for light metal alloys
patents.google.com
2004, 23 Febr , Kejun Zeng, Thermal fatigue resistant tin-lead-silver solder.
US A - Method of etching silver-tin-lead contacts on a nickel...
patents.google.com
A method of chemically etching away lead-tin-silver alloy layers from a base in which the body is dipped in a solution of ammonia and an ammonium salt...
A Theoretical Study of the Phase Equilibria in the Cu-Cr-Zr System -...
research.aalto.fi
... phase diagrams, phase transformation, thermodynamics",. author = "Marko H\{"a}m\{"a}l\{"a}inen and Kejun Zeng",. year = "1995",. language = "English",.
Archive ouverte HAL - The ternary system Al-Ni-Ti Part I: Isothermal...
hal.archives-ouvertes.fr
Bertrand Huneau 1, 2, 3 Peter Rogl 2Kejun Zeng Rainer Schmid-Fetzer 3 Marcel Bohn 4 Joseph Bauer 1. Détails. 1 LCSIM - Laboratoire de Chimie du solide et ...
US B2 - Semiconductor device having improved contacts...
patents.google.com
US *, 16 Aug 2004, 15 Dec 2005, Kejun Zeng, Pre-doped reflow interconnections for copper pads. US *, 31 May 2005, 30 Nov
US B2 - Method and structure to reduce risk of gold...
patents.google.com
A method for reducing gold embrittlement in solder joints, and a copper-bearing solder according to the method, are disclosed. Embodiments of the...
Effect of Cu content on the interfacial reliability of SnAgCu solder...
www.infona.pl
Effect of Cu content on the interfacial reliability of SnAgCu solder joints. Autorzy. Kejun Zeng Holdford. Treść / Zawartość. main.pdf. Abstrakt ...
Effect of oxygen on the reactions in the Si/Ta/Cu metallization...
www.cambridge.org
Effect of oxygen on the reactions in the Si/Ta/Cu metallization system - Volume 16 Issue 10
Reliability of Tantalum Based Diffusion Barriers between Cu and Si |...
www.cambridge.org
Reliability of Tantalum Based Diffusion Barriers between Cu and Si - Volume Tomi Laurila, Kejun Zeng, A. Seppälä, Jyrki Molarius, Ilkka Suni, Jorma K....
Journal of Electronic Materials: Foreword — Arizona State...
asu.pure.elsevier.com
... Jeng Gong Duh, Laura J. Turbini, Albert Wu, C. Robert Kao, Fay Hua, K. N. Subramanian, Darrel Frear, Carol Handwerker, Fu Guo, Nik Chawla, Kejun Zeng.
TMS570LS3137PGE供货 - Hercules™ ARM®安全微控制器 - Hercules™ ARM®安全微控制器 -...
e2echina.ti.com
德州仪器在线技术支持社区为中国电子工程师解答技术难题，提供技术支持。德仪社区涉及模拟电子技术、单片机、MCU、嵌入式系统、DSP、数字信号处理，是采用TI芯片设计的电子工程师首选的技术交流平台。
TPS 负载开关动作出现大电压烧毁MCU - 电源管理 - 电源管理 - E2E™ 中文支持论坛
e2echina.ti.com
Kejun Zeng. 问题：电路完全参考手册（除了没有加入Rsnub)外，从1.5V电压升压到3.3V，在通过机械开关控制PMOS给MCU供电，发现在开机时会 ...
Optimization of Pb-Free Solder Joint Reliability from a Metallurgical...
www.chemeurope.com
To obtain the desired performance of Pb-free packages in mechanical tests, while the solder composition should be carefully selected, the influence of metals...
(PDF) TaC as a diffusion barrier between Si and Cu | Tomi Laurila -...
www.academia.edu
JOURNAL OF APPLIED PHYSICS VOLUME 91, NUMBER APRIL TaC as a diffusion barrier between Si and Cu Tomi Laurila,a) Kejun Zeng, and ...
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