Houssam Jomaa - Patents
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Houssam Jomaa patents Recent bibliographic sampling of Houssam Jomaa patents listed/published in the public domain by the USPTO (USPTO Patent Application #,Title):
Alternative to desmear for build-up …
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· Inventors: Houssam Jomaa, ... Thank you for viewing the Alternative to desmear for build-up roughening and copper adhesion promotion patent info
Amruthavalli P. Alur - Patents
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Amruthavalli P. Alur patents ... Houssam Jomaa, Amruthavalli P. Alur, Dilan Seneviratne Heat resistant halogen free substrate core …
Javier Soto Gonzalez - Patent Inventor
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List of recent Javier Soto Gonzalez patent applications
USPTO Image File Wrapper Petition Decisions Google Books
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... Issue Date Application No Filed Houssam Jomaa , DECISION ON REQUEST FOR RECALCULATION of PATENT ...
Patentes Desenhos Industriais Contratos de Tecnologia ...
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Sep 20, — (72) JAVIER SOTO GONZALEZ, HOUSSAM JOMAA. (74) DANNEMANN, SIEMSEN, BIGLER & IPANEMA MOREIRA. (85) › pdf › PATENTES2385
All web results to the name "Houssam Jomaa"
Integrated circuit packaging system with interconnects and ...
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US A1 * Houssam Jomaa Dual epoxy dielectric and photosensitive solder mask coatings, and processes of making same. › patents
Methods of fabricating MEMS with spacers between plates ...
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US A1 * Houssam Jomaa Routing layer for a microelectronic device, microelectronic package containing same, and method of ... › patents
Removing dry film resist residues using hydrolyzable ...
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US A1 * Houssam Jomaa Selective electroless plating for electronic substrates. Family To Family Citations. › patent
Patent US Method of fabricating printed circuit ...
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US *, 23 Dec 2009, 23 Jun 2011, Houssam Jomaa, Microelectronic device substrate fabrication. US *, 30 May ...
Patent US Selective electroless plating for Googlewww.google.com.pg › patents
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US *, 20 Sep 2006, 20 Mar 2008, Houssam Jomaa, Removing dry film resist residues using hydrolyzable membranes.
US A - Solder ball placement machine Google Patents
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A solder ball placement system incorporating a placement head moveable vertically toward and away from a solder ball shuttle having a plurality of solder...
Houssam Jomaa, Phoenix US - Patent applications
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Patent application number Description Published; : METHOD OF REMOVING UNWANTED PLATED OR CONDUCTIVE MATERIAL FROM A SUBSTRATE, AND METHOD OF ENABLING
Jomaa - Patent applications
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Houssam Jomaa, San Diego, CA US. Patent application number Description Published; : MECHANICAL ADHESION OF COPPER METALLIZATION TO DIELECTRIC WITH
SELECTIVE ELECTROLESS PLATING FOR ELECTRONIC SUBSTRATES - Patent...
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· Patent application title: SELECTIVE ELECTROLESS PLATING FOR ELECTRONIC SUBSTRATES Inventors: Houssam Jomaa (Phoenix, AZ, US) Omar …
Patent US Dual epoxy dielectric and photosensitive ...
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Veröffentlichungsnummer, US B2, US B2, US-B , US B2, US B2. Erfinder, Houssam Jomaa, ...
Patente US Microelectric package utilizing multiple ...
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US , 15 Dez 2007, 18 Jun 2009, Houssam Jomaa, Routing layer for a microelectronic device, microelectronic package containing same, and ...
US A - Method of forming raised metallic contacts on ...www.google.com.gi › patents
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US A1 * Houssam Jomaa Dual epoxy dielectric and photosensitive solder mask coatings, and processes of making same.
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