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Munich, Bavaria, Germany

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PACTECH PACKAGING TECHNOLOGIES GMBH

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Ghassem AZDASHT | LinkedIn

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View Ghassem AZDASHT’S professional profile on LinkedIn. LinkedIn is the world's largest business network, helping professionals like Ghassem AZDASHT discover ...

Ghassem Azdasht, Berlin DE - Patent applications

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Ghassem Azdasht, Berlin DE Ghassem Azdasht, Berlin DE. Patent application number Description Published; : Method and Device for Transferring a Chip to a ...

2011 SW Test Workshop - Technical Program

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SW Test is the only IEEE sponsored technical forum for test professionals involved in microelectronic wafer level testing. It is a test workshop, where...

Device for Positioning and Contacting Test Contacts - Patent...

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Patent application title: Device for Positioning and Contacting Test Contacts Inventors: Ghassem Azdasht (Berlin, DE) IPC8 Class: AG01K100FI USPC Class:

Solder Bumping for Flip Chip Technology

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