Chau-Jie Zhan

	Berkeley Chang-Chun Lee Taipei county

	Research Tao-Chih Chang Technology Assembly Ching-Kuan Industrial Inventors Tzeng

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LinkedIn: Chau-Jie Zhan | Professional Profile

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Interests

Industrial Technology Research Institute patent inventors (2011)

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Chao-ming Yu · Chao-ta Huang · Chao-wang Huang · Chao-wang Huang · Chao -wei Li · Chao-yu Chen · Charng-shing Lu · Charng-shing Lu · Chau-jie Zhan.

Business Profiles

patentbuddy: Chau-Jie Zhan

INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, Taipei County, TW, US

Books & Literature

Mechanical and Electrical Technology IVbooks.google.be › books

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[4] Ching-I Chen, Fu-Chen Cheng, Chau-Jie Zhan and Tao-Chih Chang, ” Parameter Study to the interposer Stress Analysis of Fine Pitch 3-D Stack Package,” ...

Scientific Publications

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dblp: Chau-Jie Zhan

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List of computer science publications by Chau-Jie Zhan

dblp: Y. W. Chang

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List of computer science publications by Y. W. Chang

dblp: H. Y. Peng

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List of computer science publications by H. Y. Peng

dblp: Yin-Po Hung

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List of computer science publications by Yin-Po Hung

Publications

Airiti Library華藝線上圖書館

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Mean-time-to-failure study of flip chip solder joints on Cu/Ni(V)/Al thin-film under- bump-metallization. J. Appl. Phys , 94, 連結：; (6) Chau-Jie Zhan, Chun ...

Reports & Statements

A new failure mechanism of electromigration by surface ...www.nature.com › nature › scientific reports › articles

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Yuan-Wei Chang ,; Chia-chia Hu ,; Hsin-Ying Peng ,; Yu-Chun Liang ,; Chih Chen ,; Tao-chih Chang ,; Chau-Jie Zhan &; […] Jing-Ye Juang ...

Conference Papers 研討會論文 – DAL @ NTUST 台科大設計自動化實驗室

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Updated at Jan 9, Vu Linh Nguyen*, Chin-Hsing Kuo,…

Miscellaneous

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Chau-Jie Zhan | LinkedIn

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Conference Articles - Design Automation @ CYCUME

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Design Automation @ CYCUME Chang-Chun Lee, Po Ting Lin*, Kuo-Shu Kao, Ren-Shin Cheng, Chau-Jie Zhan, John H. Lau, Tao-Chih Chang ( )

Under the Guidance of Dr. Meghana Kulkarni Prof. Abhishek ...slideplayer.com › slide

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17 References Chau-Jie Zhan, Jing-Ye Juang, Yu-Min Lin, Yu-Wei Huang, Kuo- Shu Kao, Tsung-Fu Yang, Su-Tsai Lu, Lau, J.H., Tai-Hong Chen, Lo, R., Kao, ...

TDGS - "Chau-Jie Zhan"

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"Chau-Jie Zhan" ... A total of 16 records were found in seconds. Fetch | Report | Google

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Search results for: Chau-Jie Zhan ... John H. Lau, Ching-Kuan Lee, Chau-Jie Zhan, Sheng-Tsai Wu, more · IEEE 64th Electronic ...

Parameter study to the interposer stress analysis of fine pitch 3-D...

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th International Microsystems Packaging Assembly and Circuits th International Microsystems Packaging Assembly and Circuits ... Chau-Jie Zhan.

Microstructure evolution in microbumps for 3D-IC packaging

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th International Microsystems Packaging Assembly and ... , Tao-Chih Chang, Chau-Jie Zhan th International Microsystems Packaging Assembly and ...

Electronic Components and Technology Conference (ECTC), IEEE 61st

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2011 IEEE 61st Electronic Components and Technology Conference (ECTC IEEE 61st Electronic Components and Technology Conference ... Chau-Jie Zhan, ...

Welcome from the Mayor of San Diego - PDF - DocPlayer.net

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Lawrence Berkeley National Laboratory; Chau-Jie Zhan and Tao-Chih Chang ITRI 4.

Agglomeration of Ag3Sn compounds in microbumps during reflow for...

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Agglomeration of Ag 3 Sn compounds in microbumps during reflow for 3D-IC packaging ... Yuan-Wei Chang, Chih Chen, Tao-Chih Chang, Chau-Jie Zhan, Jin-Ye …

Bonding and electromigration of 30µm fine pitch micro-bump...

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Bonding and electromigration of 30µm fine pitch micro-bump interconnection Chau-Jie Zhan, Jing-Yao Chang ... Chau-Jie Zhan. Electron.&Optoelectron. Res.

Scilit | Article - Novel assembly framework of bi-layered molding...

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Chang-Chun Lee, Tzai-Liang Tzeng, Yi-Jing Lai, Yu-Min Lin, Chau-Jie Zhan, Tao -Chih Chang. Published: 1 October by Institute of Electrical and ...

Assembly reliability improvement of 3D-ICs packaging using ...www.infona.pl › resource

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Chau-Jie Zhan. Assembly and Reliability Technology Department, Electronics and Optoelectronics Research Laboratories, Industrial Technology… see all ...

Bonding and electromigration of 30um fine pitchPPT_word文档在线阅读与下载_免费文档

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提供Bonding and electromigration of 30um fine...

ECTC – It’s a Small World After All - 3D InCites

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Another presentation on C2W from Chau-Jie Zhan of ITRI focused on a flux-free bonding process for 30µm pitch lead-free solder micro bumps.

Rambus Inc. - Rambus Engineers and Inventors to Present Three Papers...

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Ming Li , Mandy Ji , Julia Cline , John Lau , Pei-Jer Tzeng , Chau-Jie Zhan , and Ching-Kuan Lee, Rambus. In this presentation, Rambus engineers will present ...

Zhan, TW - Patent applications

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Chau-Jie Zhan, New Taipei City TW. Patent application number Description Published; : SEMICONDUCTOR DEVICE AND ASSEMBLING METHOD THEREOF - A semiconductor

Through-silicon Hole Interposers for 3-D IC Integration | Electronics...

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Experimental/numerical analysis of halogen-free printed circuit board...

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more. COLLAPSE. Chau-Jie Zhan, Hung-Jen Chang, Tao-Chih Chang, Jung-Hua Chou · Details · Contributors · Bibliography · Quotations · Similar · Collections ...

March , Walt Disney World Swan and Dolphin ...docplayer.net › March walt-disne...

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... Nobumichi Tamura ; Tao-Chih Chang 3 ; Chau-Jie Zhan 3 ; King-Ning Tu ; UCLA; Lawrence Berkeley National Laboratory; 3 Industrial Technology Research ...